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| HCC4060B HCF4060B 14-STAGE RIPPLE CARRY BINARY COUNTER/DIVIDER AND OSCILLATOR .MEDI .COMMONRESET .FULLYSTATI .BUFFEREDI .QUI .5V,10VAND15VPARAMETRI .I .1005TESTEDFORQUI .MEETSALLREQUI UM-SPEED OPERATION C OPERATION NPUTS AND OUTPUTS ESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE C RATINGS NPUT CURRENT OF 100nA AT 18V AND 25oC FOR HCC DEVICE ESCENT CURRENT REMENTS OF JEDEC TENTATIVE STANDARD N. 13A, " STANDARD SPECIFICATIONS FOR DESCRIPTION OF ' B ' SERIES CMOS DEVICES " EY (Plastic Package) F (Ceramic Package) M1 (Micro Package) C1 (Chip Carrier) ORDER CODES : HCC4060BF HCF4060BM1 HCF4060BEY HCF4060BC1 PIN CONNECTIONS DESCRIPTION The HCC4060B (extended temperature range) and HCF4060B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in line plastic or ceramic package and plastic micropackage. The HCC/HCF4060B consist of an oscillator section and 14 ripple carry binary counter stages. The oscillator configuration allows design of either RC or crystal oscillator circuits. A RESET input is provided which reset the counter to the all 0's state and disables oscillator. A high level on the RESET line accmplishes the reset function. All counter stages are master slave flip-flops. The state of the counter is advanced one step in binary order on the negative transition of 1 (and 0). All inputs and outputs are fully buffered. Schmitt trigger action on the clock lin permits unlimited clock rise and fall time. September 1988 1/13 HCC/HCF4060B FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATING Symbol VDD * Vi II Ptot Parameter Supply Voltage: HCC Types HCF Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range Operating Temperature: HCC Types HCF Types Storage Temperature Value -0.5 to +20 -0.5 to +18 -0.5 to VDD + 0.5 10 200 100 -55 to +125 -40 to +85 -65 to +150 Unit V V V mA mW mW o o o Top Tstg C C C Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress ratingonly and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol VDD VI Top Parameter Supply Voltage: HCC Types HCF Types Input Voltage Operating Temperature: HCC Types HCF Types Value 3 to 18 3 to 15 0 to VDD -55 to +125 -40 to +85 Unit V V V C o C o 2/13 HCC/HCF4060B LOGIC DIAGRAM 3/13 HCC/HCF4060B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditios Symbol IL Parameter Quiescent Current VI (V) 0/5 HCC Types 0/10 0/15 0/20 HCF Types V OH Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Output Drive Current 0/5 HCC Types 0/5 0/10 0/15 0/5 HCF Types 0/5 0/10 0/15 IOL Output Sink Current HCC Types HCF Types IIH, IIL CI Input Leakage Current Input Capacitance 0/5 0/10 0/15 0/5 0/10 0/15 0/18 0/15 0/5 0/10 0/15 0/5 0/10 0/15 5/0 10/0 15/0 VIH 0.5/4.5 1/9 1.5/13.5 4.5/0.5 9/1 13.5/1.5 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 Any Input Any Input <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 VO (V) |IO| VDD (A) (V) 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 15 -2 -0.64 -1.6 -4.2 -1.53 -0.52 -1.3 -3.6 0.64 1.6 4.2 0.52 1.3 3.6 0.1 0.3 3.5 7 11 1.5 3 4 -1.6 -0.51 -1.3 -3.4 -1.36 -0.44 -1.1 -3.0 0.51 1.3 3.4 0.44 1.1 3.0 -3.2 -1 -2.6 -6.8 -3.2 -1 -2.6 -6.8 1 2.6 6.8 1 2.6 6.8 10-5 10-5 5 0.1 0.3 7.5 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -1.15 -0.36 -0.9 -2.4 -1.1 -0.36 -0.9 -2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 1 A A pF mA mA TLOW * Min. Max. 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 V V Value 25 oC Min. Typ. Max. 0.04 0.04 0.04 0.08 0.04 0.04 0.04 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 V V THIGH * Min. Max. 150 300 600 3000 150 300 600 A Unit VOL V IL IOH * TLOW = -55 oC for HCC device: -40 oC for HCF device. * THIGH = +125 oC for HCC device: +85 oC for HCF device. The Noise Margin for both "1" and "0" level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. with VDD = 15 V 4/13 HCC/HCF4060B DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 o C, C L = 50 pF, RL = 200 K, o typical temperature coefficent for all VDD values is 03 %/ C, all input rise and fall times= 20 ns) Symbol tPLH tPHL tPLH tPHL tTLH tTHL tW Parameter Propagation Delay Time ( to Q4 out) Propagation Delay Time (Qn to Qn+1) Transition Time Test Conditions VDD (V) 5 10 15 5 10 15 5 10 15 f = 100KHz 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 CX = 200pF RS = 560K RX = 50 K CX = 200pF RS = 560K RX = 50 K CX CX CX RX RX RX RX CX = = = = = = = = 10F 50F 10F 500 K 300 K 300 K 5K 15pF 5 10 15 5 to 10 10 to 15 5 10 15 5 10 15 10 15 18 20 21.1 Min. Value Typ. 370 150 100 100 50 40 100 50 40 50 20 15 Unlimited 3.5 8 12 7 16 24 180 80 50 60 30 20 21.5 23 24 360 160 100 120 60 40 25 26 27 2 1 20 20 10 1000 50 50 810 94 M Max. 740 300 200 200 100 80 200 100 80 100 40 30 Unit ns ns ns Input Pulse Width ns tr, tf Input Pulse Rise and Fall Time s fmax Maximum Clock Input Frequency MHz RESET OPERATION Propagation Delay Time tPHL ns tW Reset Pulse Width ns RC OPERATION Variation of Frequency (Unit-to-Unit) KHz Variation of Frequency With Voltage Change (Same Unit) RX CX mF Maximum Oscillator Frequency * 530 690 650 800 pF * RC oscillator applications are not recommended at supply voltages below 7V for RX = 50K 5/13 HCC/HCF4060B Typical Output Low (sink) Current Characteristics Minimum Output Low (sink) Current Characteristics Typical Output High (source) Current Characteristics Minimum Output High (source) Current Characteristics 6/13 HCC/HCF4060B DETAIL OF TYPICAL FILP-FLOP STAGE TYPICAL RC OSILLATOR CIRCUIT TYPICAL CRYSTAL OSCILLATOR CIRCUIT 7/13 HCC/HCF4060B TEST CIRCUITS Quiescent Device Current. Noise Immunity. Input Leakage Current. 8/13 HCC/HCF4060B Plastic DIP16 (0.25) MECHANICAL DATA mm MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 inch TYP. MAX. DIM. P001C 9/13 HCC/HCF4060B Ceramic DIP16/1 MECHANICAL DATA mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 0.51 0.38 17.78 2.79 0.55 1.52 0.31 1.27 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.020 3.3 0.015 0.700 0.110 0.022 0.060 0.012 0.050 0.406 0.317 0.200 TYP. MAX. 20 7 0.130 MIN. inch TYP. MAX. 0.787 0.276 DIM. P053D 10/13 HCC/HCF4060B SO16 (Narrow) MECHANICAL DATA DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 9.8 5.8 1.27 8.89 4.0 5.3 1.27 0.62 8 (max.) 0.149 0.181 0.019 10 6.2 0.35 0.19 0.5 45 (typ.) 0.385 0.228 0.050 0.350 0.157 0.208 0.050 0.024 0.393 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.004 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010 P013H 11/13 HCC/HCF4060B PLCC20 MECHANICAL DATA mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180 DIM. P027A 12/13 HCC/HCF4060B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13 |
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